Thermoelectric Processor Coolers

Image for MAG58630/58630-G and MAG68634

Many of today's high performance processors and electric devices perform at a very high temperature. Over heating can deteriorate performance and causes a shorter working life.

The modern solution is TECool - Active Thermoelectric CPU Cooler. A 10ºC reduction in chip temperature equals 3-5 MHz speed increase at the board level. In addition, a 10ºC temperature drop results in two times MTBF improvement.

The Thermoelectric Cooler is new state of the art device that provides maximum protection for Pentium, Pentium Pro, Celeron, Pentium II/III, PowerPC, Cyrix 6x86, AMD K5 & K6 microprocessors, 3D graphics GPU chips, and electric devices requiring heat reduction. In addition to provide a high performance pin fin heat sink and ball bearing fan, the TECool system adds an active thermoelectric cooling module with MTBF 200K hours, which actually creates cold enabling temperature to be substantially reduced and extending CPU and GPU life.

ADVANTAGES
1. Reduces chip temperature tremendously
2. Low acoustic noise
3. Low profile
4. Guarantees CPU and GPU life and improves CPU and GPU speed
5. CPU and GPU temperature can be below ambient
6. Direct cooling with no vibration or pollution
7. Direct, simple, fast installation

MAG58630 consists 30x30mm TEC, 50x50x10mm ball bearing IC fan, and 50x50x18mm heat sink which is suitable for 3D graphics GPU, high performance PC chipset, ASIC /PGA/BGA ICs needing no Green function or disabling Green function.  It has many other applications, for example, cooling a laser diode, memory chip, etc... It is a solid state 12W heat pump.  Customer's design welcome.

MAG58630-G has the same features as MAG58630, but adding temperature control function. The cooler automatically shuts off at approximately 25ºC to prevent over cooling to dew point while conserving energy.  When full power is resumed to the device to be cooled, the cooler self starts and once again is enabled. A LED indicates the thermoelectric cooling module is working.  It is a solid state 12W heat pump.  Customer's design welcome.

MAG-CM25 consists 30x30mm TEC, 60x60x10mm ball bearing IC fan, and 60x65x47mm heat sink for CPU on socket 7, 370 , A, and 462, and other high performance ASICs with the heat dissipation 30W.  It is a solid state 30W heat pump. Customer's design welcome.

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You can buy from
www.halted.com
www.sandyselectronicparts.com

TECool-78640 CPU Cooler consists 40x40mm TEC, 60x60x25mm double ball bearing IC fan, and 62x62x45mm heat sink for Socket 370/Socket A/Socket 462 Athlon XP up to 3400+.   It can be equipped a solid state 70W~100W heat pump according to your CPU thermal power dissipation need. A copper base on the cold side of TEC provides superior thermal interface with the surface of CPU to absorb and dissipate heat.  It is an ideal cooling device to make CPU operation at low temperature and even under ambient.  From the document of Intel and AMD, you can find that the maximum thermal power dissipation of most CPUs is around 89.0W.  We welcome to assembly an OEM cooler from customer's requirement.

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You can buy from
www.halted.com
www.sandyselectronicparts.com

For more information, please send e-mail to info2008@magaland.com or magaland@aol.com

Q:  What will happen if CPU overcooled?  How can I prevent?

A:   If CPU is idle and  a TEC  CPU cooler continues cooling CPU,  the surface temperature of CPU will be under dew point.  It will not hurt CPU, but moisture will be created at dew point.  Tiny drops of moisture condensed on cool surface will short the circuit.  There are three ways that can prevent or solve  TEC from moisture in cold temperature.  

1.  Disabling CPU power management function (namely green function).

2.  Adding a temperature sensor to turn off power of TEC before temperature reaching dew point.

3.  Placing a sponge foam around TEC to absorb moisture.  Moisture in sponge foam will be evaporated when CPU power resumed.

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