Thermally Conductive Double-Sided Adhesive
Tapes
Compatibility with Intel, AMD, Cyrix processors
and any other high performance PGA and BGA chip
The tape provides an effective thermal interface between electronic components and heat sinks. These materials have exceptional bonding properties - eliminating the need for mechanical fasteners. The tape is high bond strength, pressure sensitive acrylic adhesive, loaded with aluminum oxide and coated onto 0.002 inch (0.050 mm) aluminum carrier. The aluminum foil provides added thermal conductivity for applications where electrical isolation is not required.
Typical Properties |
MAG82730 / 82740 |
| Carrier | Aluminum |
| Color | White |
| Thermal Conductivity (W/m-K) | 0.50 |
| Thermal Impedance, °C -in2/Watt (@<1 psi) (°C -cm2/Watt) |
0.5 |
| Thickness inch (mm) | 0.006 (0.152) |
| Lap Shear Adhesion psi (MPa) | 135 (0.931) |
| Die Shear Adhesion psi (MPa) Aluminum 25°C 150°C Aluminum Oxide Substrate 25°C 150°C |
|
| Creep Adhesion Days 25°C , 12 psi (0.083 MPa) 150°C , 12 psi (0.083 MPa) |
|
| UL Flammability Rating | 94V-0 |
Where to buy:
Fry's Electronics (PLU # 52977 and 2779873) or Fry's Outpost online
www.outpost.com
(Outpost # 52977 and 2779873)
Anchor
Electronics
Sandys Electronic
Parts
MAG82730: 30mm(W) x 90mm(L) MAG82740: 40mm(W) x 80mm(L)
For more information, please email to info2010@magaland.com or magaland@aol.com
Q&A:
Q.: Can Thermally Conductive Double-Sided Adhesive Tape be
applied all types of processors?
A.: Not quite. Thermally Conductive Double-Sided Adhesive
Tape can be only applied on these processors that have the contact area
(metal and ceramic) at least 25x25mm and larger. Therefore, Thermally
Conductive Double-Sided Adhesive Tape is not suitable for some INTEL
and AMD FLIP CHIP CPUs because the
size of flip chip is only 10x15mm or less.
Q.: What are the Thermally Conductive Double-Sided Adhesive
Tape mostly applied to?
A.: They are mostly applied on 3D graphics GPU, high
performance PC chipset, and other high performance ASIC PGA, BGA chips, memory
chips, RAM, etc...
Q.: How to remove the Thermally Conductive Double-Sided Adhesive
Tape?
A.: Material needed: Single-edged razor blade or a small, thin
blade pocket knife; soft thin metal spatula or thin edge of plastic sheet
(it should be strong enough). Use safety and precautions when handling
sharp instruments!
Step 1: Carefully insert the blade edge into the bond line at a comer between the heatsink and the component. The penetration need not be very deep.
Step 2: Remove the blade and insert the spatula or plastic sheet into the wedge. Slowly twist the spatula blade or the edge of plastic sheet so that it exerts a slight upward pressure.
Step 3: As the two surfaces start to separate, move the spatula blade or the edge of plastic sheet deeper into the bond line and continue the twisting motion and upward force.
Step 4: After the two components are separated, the tape can be removed and discarded (the old tape can not be reused). If adhesive remains on the component surface, it must be removed. Adhesive is best removed by wiping with a rag dabbed with isopropyl alcohol.
Step 5: Let solvent cleaned components air dry for 15 minutes before reapplying a new tape.