Thermally Conductive Double-Sided Adhesive Tapes
Compatibility with Intel, AMD, Cyrix processors and any other high performance PGA and BGA chip

The tape provides an effective thermal interface between electronic components and heat sinks.  These materials have exceptional bonding properties -  
eliminating the need for mechanical fasteners. The tape is high bond strength, pressure sensitive acrylic adhesive, loaded with aluminum oxide and coated
 onto 0.002 inch (0.050 mm) aluminum carrier. The aluminum foil provides added thermal conductivity for applications where electrical isolation is not      
 required.                                                                                                                                                                                                                       

Typical Properties

  MAG82730 / 82740  
Carrier

Aluminum
Color

White
Thermal Conductivity (W/m-K)

0.50
Thermal Impedance, °C -in2/Watt
    (@<1 psi)             (°C -cm2/Watt)

0.5
(3.4)
Thickness inch (mm)

0.006 (0.152)
Lap Shear Adhesion psi (MPa)

135 (0.931)
Die Shear Adhesion psi (MPa)
                             Aluminum   25°C
                                              150°C
     Aluminum Oxide Substrate  25°C
                                              150°C  


125 (0.862)
55 (0.379)
145 (1.00)
60 (0.414)
Creep Adhesion Days
               25°C , 12 psi (0.083 MPa)
             150°C , 12 psi (0.083 MPa)


>50
>10
UL Flammability Rating

94V-0

Where to buy:
www.outpost.com (Outpost # 52977 and 2779873)
Anchor Electronics
Sandys Electronic Parts



MAG82730: 30mm(W) x 90mm(L)     MAG82740: 40mm(W) x 80mm(L)

For more information, please email info2010@magaland.com or magaland@aol.com


Questions & Answer:

 Q.:  Can Thermally Conductive Double-Sided Adhesive Tape be applied all types of processors?                                                                                  
A.:  Not quite. Thermally Conductive Double-Sided Adhesive Tape can be only applied on these processors that have the contact area (metal and       
ceramic) at least 25x25mm and larger.  Therefore, Thermally Conductive Double-Sided Adhesive Tape is not suitable for some INTEL and   
AMD FLIP CHIP CPUs because the size of flip chip is only 10x15mm or less.                                                                                              

Q.:  What are the Thermally Conductive Double-Sided Adhesive Tape mostly applied to?                                                                                           
A.:  3D graphics GPU,  high performance PC chipset, and other high performance ASIC PGA, BGA chips, memory chips, RAM, etc.                           

Q.:  How to remove the Thermally Conductive Double-Sided Adhesive Tape?                                                                                                            
 A.:  Material needed: Single-edged razor blade or a small, thin blade pocket knife; soft thin metal spatula or thin edge of plastic sheet (it should be            
strong enough).Use safety and precautions when handling sharp instruments!                                                                                                     

Step 1:  Carefully insert the blade edge into the bond line at a comer between the heatsink and the component.  The penetration need not be very deep.

Step 2:  Remove the blade and insert the spatula/plastic sheet into the wedge. Slowly twist the spatula blade or the edge of plastic sheet so that it exerts
     a slight upward pressure.                                                                                                                                                                        

Step 3:  As the two surfaces start to separate, move the spatula blade or the edge of plastic sheet deeper into the bond line and continue the twisting    
   motion and upward force.                                                                                                                                                                    

Step 4:  After the two components are separated, the tape can be removed and discarded (the old tape can not be reused).  If adhesive remains on the
component surface, it must be removed.  Adhesive is best removed by wiping with a rag dabbed with isopropyl alcohol.                    

Step 5:  Let solvent cleaned components air dry for 15 minutes before reapplying a new tape.                                                                                    

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