![[IMAGE]](pfh.gif)
Image for MAG58630/58630-G
and MAG68634
Image for MAG58630/58630-G
and MAG68634
Many of today's high performance
processors and electric devices perform at a very high temperature. Over
heating can deteriorate performance and causes a shorter working life.
The modern solution is
TECool - Active
Thermoelectric Cooler. A 10ºC reduction in chip temperature equals 3-5
MHz speed increase at the board level. In addition, a 10ºC temperature
drop results in two times MTBF improvement.
The Thermoelectric Cooler is new state of the art device that provides maximum
protection for high performance processors, ASIC, IC chips, and electric
devices requiring heat reduction. In addition to provide a high performance
pin fin heat sink and ball bearing fan, the TECool system adds an active
thermoelectric cooling module with MTBF 200K hours, which actually
creates cold enabling temperature to be substantially reduced and extending
high performance processors, ASIC, and IC chips life.
ADVANTAGES
1. Reduces IC chips temperature tremendously
2. Low acoustic noise
3. Low profile
4. Guarantees IC chips life and improves IC chips performance and speed
5. IC chips temperature can be below ambient
6. Direct cooling with no vibration or pollution
7. Direct, simple, fast installation
MAG-58630
consists 30x30mm TEC, 50x50x10mm ball bearing
IC fan, and 50x50x18mm heat sink which is suitable for high performance PC
chipset, ASIC /PGA/BGA ICs needing no Green function or disabling Green function.
It has many other applications, for example, cooling a laser diode,
memory chip, etc... It is a solid state 12W heat pump. Customer's design
welcome.
$29.95+$5.00(S&H)
MAG-58630G has the same features as MAG58630, but adding temperature control function. The cooler automatically shuts off at approximately 25ºC to prevent over cooling to dew point while conserving energy. When full power is resumed to the device to be cooled, the cooler self starts and once again is enabled. A LED indicates the thermoelectric cooling module is working. It is a solid state 12W heat pump. Customer's design welcome.
MAG-CM25 consists 30x30mm TEC, 60x60x10mm ball bearing IC fan, and 60x65x47mm heat sink for CPU on socket 7, 370 , A, and 462, and other high performance ASICs with the heat dissipation 30W. It is a solid state 30W heat pump. Customer's design welcome.
Click for bigger
image
$34.95+$5.00(S&H)
TECool-78640 consists 40x40mm TEC, 60x60x25mm double ball bearing IC fan, and 62x62x45mm heat sink for Socket 370/Socket A/Socket 462 Athlon XP up to 3400+. It can be equipped a solid state 70W~100W heat pump according to your CPU thermal power dissipation need. A copper base on the cold side of TEC provides superior thermal interface with the surface of CPU to absorb and dissipate heat. It is an ideal cooling device to make CPU operation at low temperature and even under ambient. From the document of Intel and AMD, you can find that the maximum thermal power dissipation of most CPUs is around 89.0W. We welcome to assembly an OEM cooler from customer's requirement.
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for bigger image
$39.95+$5.00(S&H)
Or you can buy from
www.halted.com
www.sandyselectronicparts.com
For more information, please send e-mail to info2010@magaland.com or magaland@aol.com
Q: What will happen if CPU overcooled? How can I prevent?
A: If CPU is idle and a TEC CPU cooler continues cooling CPU, the surface temperature of CPU will be under dew point. It will not hurt CPU, but moisture will be created at dew point. Tiny drops of moisture condensed on cool surface will short the circuit. There are three ways that can prevent or solve TEC from moisture in cold temperature.
1. Disabling CPU power management function (namely green function).
2. Adding a temperature sensor to turn off power of TEC before temperature reaching dew point.
3. Placing a sponge foam around TEC to absorb moisture. Moisture in sponge foam will be evaporated when CPU power resumed.